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[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Process and productivity results from a carrier-based linear transport PVD system for RDL seed layer deposition in fan-out packaging applications
Bluck, Terry, Chen, Chun-Chung, Gallagher, Daniel, Kudriavstev, Vladimir, Mandrell, Lisa, Runstadler, Billy, Smith, Chris, Werbaneth, PaulYear:
2017
DOI:
10.1109/EPTC.2017.8277587
File:
PDF, 627 KB
2017