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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - The study on elastic properties of Cu3Sn under pressure via first-principle calculations
Niu, Fan-Fan, Luan, Xing-He, Feng, Chuang, Zhang, Ying-Hong, Yang, Dao-Guo, Qin, Hong-Bo, Jiang, Hong-Jie, Liu, Feng-MeiYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046656
File:
PDF, 1.03 MB
english, 2017