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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Numerical analysis of thickness uniformity of thin film deposited by rectangular planar target
Zhu, Guo, Sun, Jiangping, Guo, Xiongxiong, Zou, Xixi, Zhang, Libin, Gan, ZhiyinYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046688
File:
PDF, 670 KB
english, 2017