[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Nano-Cu sintering paste for high power devices die attach applications
Zhao, Jinjin, Yao, Min, Lee, Ning-ChengYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046761
File:
PDF, 3.18 MB
english, 2017