[IEEE 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Amsterdam (2017.9.27-2017.9.29)] 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Dynamic compact thermal model extraction for LED packages using model order reduction techniques
Lungten, Sangye, Bornoff, Robin, Dyson, James, Maubach, Joseph M. L., Schilders, Wil H. A., Warner, MattYear:
2017
Language:
english
DOI:
10.1109/therminic.2017.8233791
File:
PDF, 672 KB
english, 2017