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[IEEE 2017 23rd International Workshop on Thermal...

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[IEEE 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Amsterdam (2017.9.27-2017.9.29)] 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Dynamic compact thermal model extraction for LED packages using model order reduction techniques

Lungten, Sangye, Bornoff, Robin, Dyson, James, Maubach, Joseph M. L., Schilders, Wil H. A., Warner, Matt
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Year:
2017
Language:
english
DOI:
10.1109/therminic.2017.8233791
File:
PDF, 672 KB
english, 2017
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