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[IEEE 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Amsterdam (2017.9.27-2017.9.29)] 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Thermal conduction in novel isotropic conductive adhesive
Kristiansen, Helge, Redford, Keith, Helland, Susanne, Kalland, Erik, Hoglund, Nina H., Ras, Mohammad Abo, Grosse, Corinna, Hay, Bruno, Ramiandrisoa, Liana, Davee, Guillaume, Gomes, Severine, PettersenYear:
2017
Language:
english
DOI:
10.1109/therminic.2017.8233820
File:
PDF, 715 KB
english, 2017