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[IEEE 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Amsterdam (2017.9.27-2017.9.29)] 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Experimental and modelling thermal study of a 3D-stacked silicon based LEDs array concept
Chambion, B., Bouillard, B., Gasse, A., Vandeneynde, A., Ait-Mani, N., Gueugnot, A., Henry, D., Mercier, F., Rueda, P.Year:
2017
Language:
english
DOI:
10.1109/therminic.2017.8233843
File:
PDF, 1024 KB
english, 2017