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A New Method to Determine Crack Shape and Size in Solder Joints
Reinikainen, T., Wulff, F. W., Kolbe, W., Ahrens, T.Volume:
117
Year:
1995
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2792103
File:
PDF, 637 KB
english, 1995