[IEEE 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Seoul, South Korea (2017.6.20-2017.6.23)] 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Mitigation of unintentional radiation from the package lid using PMC packaging
Yang, Xiao-Li, Li, Er-Ping, Li, Yong-Sheng, Zhu, Dong-Ke, Cheng, Ping, Yu, Hui-Chun, Li, BinYear:
2017
Language:
english
DOI:
10.1109/apemc.2017.7975471
File:
PDF, 476 KB
english, 2017