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[IEEE 2017 IEEE International Symposium on Circuits and Systems (ISCAS) - Baltimore, MD, USA (2017.5.28-2017.5.31)] 2017 IEEE International Symposium on Circuits and Systems (ISCAS) - Fault tolerant techniques for TSV-based interconnects in 3-D ICs
Madani, Siroos, Bayoumi, MagdyYear:
2017
Language:
english
DOI:
10.1109/iscas.2017.8050944
File:
PDF, 198 KB
english, 2017