Analyses and statistics of the electrical fail for flip...

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Microsystem Technologies 2017 / 10

Analyses and statistics of the electrical fail for flip chip packaging by using ANSYS simulation software and really underfill materials

Tsai, Shang-Te, Lin, Chi-Yu, Wu, Sung-Mao, Chang, Chung-Yao, Yang, Cheng-Fu
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Language:
english
Journal:
Microsystem Technologies
DOI:
10.1007/s00542-017-3605-4
Date:
October, 2017
File:
PDF, 2.31 MB
english, 2017
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