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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Effect of isothermal aging on mechanical properties and strain rate sensitivity of the eutectic Sn-58Bi solder alloy
Zhou, Zhou, Ma, Xiao, Zhou, Min-Bo, Yin, Can, Zhang, Xin-PingYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046739
File:
PDF, 1.47 MB
english, 2017