[IEEE 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) - Constanta, Romania (2017.10.26-2017.10.29)] 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) - Void separation efficiency of vacuum VPS technology on FR4 and LTCC substrates
Illes, Balazs, Skwarek, Agata, Geczy, Attila, Szwagierczak, Dorota, Witek, KrzysztofYear:
2017
Language:
english
DOI:
10.1109/SIITME.2017.8259859
File:
PDF, 1.05 MB
english, 2017