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[IEEE 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) - Constanta, Romania (2017.10.26-2017.10.29)] 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) - Effect of resistance of conductive adhesive joint on course of its aging
Mach, Pavel, Barto, SebaYear:
2017
Language:
english
DOI:
10.1109/SIITME.2017.8259865
File:
PDF, 309 KB
english, 2017