![](/img/cover-not-exists.png)
[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Study of Cu-Cu low temperature direct bonding and contact resistance measurement on bonding interface
Yang, Wenhua, Lu, Yangting, Zhou, Chenggong, Zhang, Jian, Tadatomo, SugaYear:
2017
Language:
english
DOI:
10.1109/icept.2017.8046712
File:
PDF, 799 KB
english, 2017