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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Assessment of solder paste technology limitation at miniaturization for SIP and SMT application
Keck, Joanna, Lee, Ning-ChengYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046760
File:
PDF, 1.42 MB
english, 2017