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[IEEE 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Chengdu, China (2017.7.4-2017.7.7)] 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Mechanism of abnormal dual-peak profiles in large tilt-angle ion implantation studied by SRIM analysis
Zhu, Lei, Tan, Pik Kee, Wang, Dandan, Huang, Yamin, Lam, Jeffrey, Mai, Zhi HongYear:
2017
Language:
english
DOI:
10.1109/IPFA.2017.8060109
File:
PDF, 236 KB
english, 2017