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[IEEE 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) - Constanta (2017.10.26-2017.10.29)] 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) - Numerical investigation of channel dimension effects on the performance of a cross flow micro heat exchanger for chip cooling applications
Ionescu, Viorel, Neagu, Anisoara-ArlezianaYear:
2017
Language:
english
DOI:
10.1109/SIITME.2017.8259877
File:
PDF, 521 KB
english, 2017