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IEEE Transactions on Device and Materials Reliability 2018

Failure Mode and Mechanism Analysis for Cu Wire Bond on Cu/Low-k Chip by Wire Pull Test and Finite Element Analysis

Che, Fa Xing, Wai, Leong Ching, Chai, Tai Chong
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Year:
2018
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/TDMR.2018.2808348
File:
PDF, 945 KB
english, 2018
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