Embedded Two-Phase Cooling of High Flux Electronics via...

  • Main
  • 2018 / 02
  • Embedded Two-Phase Cooling of High Flux Electronics via...
Journal of Electronic Packaging 2018 / 02

Embedded Two-Phase Cooling of High Flux Electronics via Press-Fit and Bonded FEEDS Coolers

Raphael, Mandel, Daniel, Bae, Michael, Ohadi
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4039264
Date:
February, 2018
File:
PDF, 2.93 MB
english, 2018
Conversion to is in progress
Conversion to is failed