[IEEE 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Haining, Hangzhou, China (2017.12.14-2017.12.16)] 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Modeling and characterization of polymer-embedded through-silicon vias (TSVs) in 3-D integrated circuits

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