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A Method of Extracting the Effective Copper Surface Roughness of a PCB Laminate In Situ
Ellison, Jason J., Agili, Sedig S.Volume:
60
Language:
english
Journal:
IEEE Transactions on Electromagnetic Compatibility
DOI:
10.1109/TEMC.2018.2798290
Date:
August, 2018
File:
PDF, 1.90 MB
english, 2018