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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - A low-melting-point alloy filled epoxy conductive adhesives as thermal interface materials
Kang, Jia-Hui, Sheng, Jia-Li, Fu, Xian-Zhu, Sun, Rong, Wong, Ching-PingYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046574
File:
PDF, 440 KB
english, 2017