![](/img/cover-not-exists.png)
[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Influences of the Ar/H2 plasma activation on the bonding strength and reliability of chips and substrates assembly
Chuang, Cheng-Li, Aoh, Jong-Ning, Lin, Bao-ChuYear:
2017
Language:
english
DOI:
10.1109/icept.2017.8046498
File:
PDF, 1.29 MB
english, 2017