Nanocomposite SAC Solders: The Effect of Adding Ni and...

Journal of Electronic Materials 2018 / 1 Vol. 47; Iss. 1

Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders

Yakymovych, A., Švec, P., Orovcik, L., Bajana, O., Ipser, H.
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Volume:
47
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-017-5834-9
Date:
January, 2018
File:
PDF, 1.07 MB
english, 2018
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