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Analytical model for adhesive die-attaching subjected to thermal loads using second-order beam theory
He, Jiangbo, Zhou, Wu, He, Xiaoping, Yu, Huijun, Peng, Peng, Wang, ShuangVolume:
82
Language:
english
Journal:
International Journal of Adhesion and Adhesives
DOI:
10.1016/j.ijadhadh.2018.01.016
Date:
April, 2018
File:
PDF, 756 KB
english, 2018