Ku DNA End-Binding Activity Promotes Repair Fidelity and...

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Ku DNA End-Binding Activity Promotes Repair Fidelity and Influences End-Processing During Nonhomologous End-Joining in Saccharomyces cerevisiae

Emerson, Charlene H., Lopez, Christopher R., Ribes-Zamora, Albert, Polleys, Erica J., Williams, Christopher L., Yeo, Lythou, Zaneveld, Jacques E., Chen, Rui, Bertuch, Alison A.
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Language:
english
Journal:
Genetics
DOI:
10.1534/genetics.117.300672
Date:
March, 2018
File:
PDF, 8.38 MB
english, 2018
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