Microstructural evolution and IMCs growth behavior of Sn-58Bi-0.25Mo solder joint during aging treatment
Yang, Li, Zhu, Lu, Zhang, Yaocheng, Zhou, Shiyuan, Xiong, Yifeng, Wu, PengchengVolume:
5
Language:
english
Journal:
Materials Research Express
DOI:
10.1088/2053-1591/aaad71
Date:
February, 2018
File:
PDF, 3.69 MB
english, 2018