Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C...

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Electronic Materials Letters 2018 / 3

Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu–Cu Thermocompression Bonding Using Stress Engineering

Panigrahi, Asisa Kumar, Ghosh, Tamal, Kumar, C. Hemanth, Singh, Shiv Govind, Vanjari, Siva Rama Krishna
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Language:
english
Journal:
Electronic Materials Letters
DOI:
10.1007/s13391-018-0037-y
Date:
March, 2018
File:
PDF, 1.43 MB
english, 2018
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