Uncertainty Quantification for Junction Temperature of Automotive LED With Die-Attach Layer Microstructure
Zhou, Jing, Long, Xingming, He, Jugang, Ren, Fan, Fang, LiangVolume:
18
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/TDMR.2018.2796072
Date:
March, 2018
File:
PDF, 6.16 MB
english, 2018