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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Study of the wafer warpage evolution by cooling to extremely low temperatures
Cheng, Gong, Gai, Wei, Xu, Gaowei, Luo, LeYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046525
File:
PDF, 914 KB
english, 2017