Low-Pressure-Assisted Large-Area (>800 mm...

IEEE Transactions on Components Packaging and Manufacturing Technology 2018 / 2 Vol. 8; Iss. 2

Low-Pressure-Assisted Large-Area (>800 mm 2 ) Sintered-Silver Bonding for High-Power Electronic Packaging

Tan, Yan-Song, Li, Xin, Chen, Xu, Lu, Guo-Quan, Mei, Yun-Hui
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Volume:
8
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2017.2773100
Date:
February, 2018
File:
PDF, 2.78 MB
english, 2018
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