Unequal bonding in Ag–CuIn 3 Se 5 -based solid solutions responsible for reduction in lattice thermal conductivity and improvement in thermoelectric performance
Cui, Jiaolin, Lu, Yufu, Chen, Shaoping, Liu, Xianglian, Du, ZhengliangVolume:
8
Year:
2018
Language:
english
Journal:
RSC Advances
DOI:
10.1039/C8RA00316E
File:
PDF, 644 KB
english, 2018