A quality quantitative method of silicon direct bonding...

Journal of Micromechanics and Microengineering 2018 / 04 Vol. 28; Iss. 4

A quality quantitative method of silicon direct bonding based on wavelet image analysis

Tan, Xiao, Tao, Zhi, Li, Haiwang, Xu, Tiantong, Yu, Mingxing
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Volume:
28
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/1361-6439/aaac5e
Date:
April, 2018
File:
PDF, 4.14 MB
english, 2018
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