[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Glass Based 3D-IPD Integrated RF ASIC in WLCSP
Lee, Teck Chong, Chang, Yung-Shun, Hsu, Che-Ming, Hsieh, Sheng-Chi, Lee, Pao-Nan, Hsieh, Yu-Chang, Wang, Long-Ching, Zhang, LijuanYear:
2017
Language:
english
DOI:
10.1109/ECTC.2017.328
File:
PDF, 714 KB
english, 2017