![](/img/cover-not-exists.png)
[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Optimized design of high precision heating stage for die attach equipment
Yao, Lixin, Wang, Junshuai, Wang, Zhiyue, Ye, Lezhi, Xu, Pinlie, Lang, Ping, Gao, YueYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046626
File:
PDF, 1.14 MB
english, 2017