Ruggedness Characterization of Bonding Wire Arrays in LDMOSFET-Based Power Amplifiers
Lin, Liang, Hua, Yu-Jie, Zhou, Liang, Wu, Qi, Mao, Junfa, Yin, Wen-YanYear:
2017
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2017.2773624
File:
PDF, 2.32 MB
english, 2017