Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique
Wang, Chuen-Ching, Ye, Yao-Ting, Lin, Jing-FungVolume:
131
Year:
2009
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4000363
File:
PDF, 619 KB
english, 2009