Transient thermal characteristics of high-temperature SiC...

Japanese Journal of Applied Physics 2018 / 04 Vol. 57; Iss. 4S

Transient thermal characteristics of high-temperature SiC power module enhanced with Al-bump technology

Tanisawa, Hidekazu, Kato, Fumiki, Koui, Kenichi, Sato, Shinji, Watanabe, Kinuyo, Takahashi, Hiroki, Murakami, Yoshinori, Sato, Hiroshi
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Volume:
57
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/JJAP.57.04FR10
Date:
April, 2018
File:
PDF, 1.05 MB
english, 2018
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