High Shock-Resistant Design for Wafer-Level-Packaged...

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High Shock-Resistant Design for Wafer-Level-Packaged Three-Axis Accelerometer With Ring-Shaped Beam

Kazama, Atsushi, Aono, Takanori, Okada, Ryoji
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Year:
2018
Language:
english
Journal:
Journal of Microelectromechanical Systems
DOI:
10.1109/JMEMS.2018.2808165
File:
PDF, 3.28 MB
english, 2018
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