Room Temperature Temporary Bonding of Glass Substrates...

Room Temperature Temporary Bonding of Glass Substrates Based on SAB Method Using Si Intermediate Layer

Takeuchi, Kai, Fujino, Masahisa, Suga, Tadatomo
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Volume:
7
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2017.2731621
Date:
October, 2017
File:
PDF, 2.17 MB
english, 2017
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