[IEEE 2017 IEEE International Symposium on Circuits and Systems (ISCAS) - Baltimore, MD, USA (2017.5.28-2017.5.31)] 2017 IEEE International Symposium on Circuits and Systems (ISCAS) - Contactless inter-tier communication for heterogeneous 3-D ICs
Papistas, Ioannis A., Pavlidis, Vasilis F.Year:
2017
Language:
english
DOI:
10.1109/iscas.2017.8050946
File:
PDF, 132 KB
english, 2017