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[IEEE 2018 Pan Pacific Microelectronics Symposium (Pan Pacific) - Big Island, HI, USA (2018.2.5-2018.2.8)] 2018 Pan Pacific Microelectronics Symposium (Pan Pacific) - “New automotive” — Considerations for reliability, robustness and resilience for CMOS interconnects
Weide-Zaage, Kirsten, Fremont, Helene, Hein, VerenaYear:
2018
Language:
english
DOI:
10.23919/PanPacific.2018.8318993
File:
PDF, 534 KB
english, 2018