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[IEEE 2018 Pan Pacific Microelectronics Symposium (Pan Pacific) - Big Island, HI, USA (2018.2.5-2018.2.8)] 2018 Pan Pacific Microelectronics Symposium (Pan Pacific) - Heterogeneous and homogeneous package integration technologies at device and system levels
Tummala, Rao, Nedumthakady, Nithin, Ravichandran, Siddharth, DeProspo, Bartlet, Sundaram, VenkateshYear:
2018
Language:
english
DOI:
10.23919/PanPacific.2018.8318986
File:
PDF, 491 KB
english, 2018