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[IEEE 2018 Pan Pacific Microelectronics Symposium (Pan Pacific) - Big Island, HI, USA (2018.2.5-2018.2.8)] 2018 Pan Pacific Microelectronics Symposium (Pan Pacific) - Intermetallic compound formation and mechanical property of SN-CU-XCR/CU lead-free solder joint
Bang, Junghwan, Yu, Dong-Yurl, Ko, Yong-Ho, Nishikawa, Hiroshi, Lee, Chang-WooYear:
2018
Language:
english
DOI:
10.23919/PanPacific.2018.8318994
File:
PDF, 1.24 MB
english, 2018