[IEEE 2018 Pan Pacific Microelectronics Symposium (Pan Pacific) - Big Island, HI, USA (2018.2.5-2018.2.8)] 2018 Pan Pacific Microelectronics Symposium (Pan Pacific) - Development of highly reliable low temperature curable photosensitive polyimide
Tomikawa, Masao, Masuda, Yuki, Shoji, Yu, Matsumura, Kazuyuki, Okuda, RyojiYear:
2018
Language:
english
DOI:
10.23919/PanPacific.2018.8319010
File:
PDF, 575 KB
english, 2018