[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Void risk prediction for Molded Underfill technology on flip chip packages
Xu, Cheng, Liu, Jun, Xu, Jian, Sun, Peng, Hsu, Chih-Chung, Huang, Chao-TsaiYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046686
File:
PDF, 1.77 MB
english, 2017