[IEEE 2016 17th International Conference on Electronic...

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[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Effect of voltage and gap on the morphology of the Ni micro-column by localized electrochemical deposition

Chen, Tao, Wang, Fuliang, Sun, Jiadong, Gao, Junling
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Year:
2016
Language:
english
DOI:
10.1109/icept.2016.7583405
File:
PDF, 1.52 MB
english, 2016
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