[IEEE 2017 IEEE Electrical Design of Advanced Packaging and...

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[IEEE 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Haining (2017.12.14-2017.12.16)] 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Electrothermal co-simulation of a two-chip power delivery network in frequency domain

Li, Na, Mao, Junfa, Zhao, Wen-Sheng, Tang, Min, Yin, Wen-Yan
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Year:
2017
Language:
english
DOI:
10.1109/EDAPS.2017.8277000
File:
PDF, 407 KB
english, 2017
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