[IEEE 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Haining (2017.12.14-2017.12.16)] 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Electrothermal co-simulation of a two-chip power delivery network in frequency domain
Li, Na, Mao, Junfa, Zhao, Wen-Sheng, Tang, Min, Yin, Wen-YanYear:
2017
Language:
english
DOI:
10.1109/EDAPS.2017.8277000
File:
PDF, 407 KB
english, 2017