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[IEEE 2017 IEEE/MTT-S International Microwave Symposium - IMS 2017 - Honololu, HI, USA (2017.6.4-2017.6.9)] 2017 IEEE MTT-S International Microwave Symposium (IMS) - 3D heterogeneous integration technology using hot via MMIC and silicon interposer with millimeter wave application
Zhou, Jun, Yang, Jiapeng, Shen, YaYear:
2017
Language:
english
DOI:
10.1109/MWSYM.2017.8058608
File:
PDF, 650 KB
english, 2017